Cu-Ti Alloy

Product Introduction

1. High mechanical strength and good formability (high mechanical strength and excellent formability of over 1GPa)

2. Higher conductivity than general titanium alloy

3. (*Special specifications) *High mechanical strength and excellent formability exceeding 1GPa

4. Highly conductive titanium-copper alloy. Excellent mechanical properties, and conductivity from 13% to 20%.

5. It has similar electrical conductivity, mechanical strength and formability as beryllium copper (heat treated material). However, it has better stress release characteristics. It is suitable for advanced switches, battery terminals, sockets and other electronic parts. It can be used as an alternative. Copper material.

6. Chemical composition (%): Ti: 1.5 – 3.5, Cu: Balance. (Cu + Ti ≧ 99.6)

Product Function

1. Higher conductivity than ordinary titanium-copper alloy (20% IACS)

2. * Excellent mechanical strength and formability.

(0.2% yield strength: 900MPa, MBR/t = minimum bend radius / thickness = 0)

*Thickness: 0.1mm

3. Excellent stress release characteristics (stress release ratio: 5% @ 150°C, 1000 hours)

4. Resistivity: 132-172 nΩ ? m(@20°C)

5. Thermal conductivity: 54 W/mK

6. Thermal expansion coefficient: 18.6 × 10-6 / K (20 to 300 ° C)

7. Young's coefficient: 127 GPa

8. Specific gravity: 8.70 g/cm3

9. Tensile strength: 785 – 1030 MPa

Applications

It is a copper alloy of the same performance as the beryllium copper after heat treatment. Suitable for:

Switch,

Connector, 

Relay device.

Battery terminal,

Socket,

Other electronic parts,

Can be used as a substitute for beryllium copper.